Semiconductor recording device

ABSTRACT

A semiconductor memory device according to the present invention comprises a hosing including a card bus connector for connection to a host device and having a PC card shape having the thickness of 5.0 mm, four SD memory cards (R: Registered trade mark) housed in the housing and a control circuit for controlling transmission/reception of a signal between the card bus connector and the respective SD memory cards (R: Registered trade mark). The semiconductor memory device is suitably used as a recording medium of the host device for which a higher data transfer rate and a larger memory capacity are demanded. Further, a semiconductor memory device, which is attachable and detachable relative to the host device and thereby portable, and relatively inexpensively obtainable, can be provided, and is directly insertable into a laptop personal computer to be used.

TECHNICAL FIELD

The present invention relates to a semiconductor memory device attachable and detachable relative to a host device such as a video camera recorder and a laptop personal computer.

BACKGROUND ART

In recent years, various types of memory cards, which are attachable and detachable relative to a host device and thereby handily portable, are widespread along with an increasingly developed larger capacity of a non-volatile semiconductor memory such as a flash memory.

An example of the memory cards is a memory card having a PC card size standardized as the PC Card Standards by the PCMCIA (Personal Computer Memory Card International Association).

In the PC Card Standards, a physical shape and a size of the card, examples of which are nominal dimensions of basic data such as a shape, a width, a length and a largest thickness of the card and tolerances of the dimensions, as well as a signal interface relative to the host device, are regulated. To exemplify the physical size of the card, a card whose nominal dimension of a width is 54.0 mm, nominal dimension of a length is 85.6 mm, and nominal dimension of a thickness in a thickest part is 5.0 mm (Type II), a card having the same nominal dimensions as in the Type II in width and length, whose nominal dimension of a thickness in a thickest part is 10.5 mm (Type III), and the like, are regulated.

Further, a memory card increasingly made available particularly for consumer use is a so-called compact-size memory card having a size smaller than that of the PC card and used as a recording medium in a commercial device such a digital camera and a mobile audio player.

As examples of the compact-size memory card, a generally called compact flash (R: Registered trade mark) card, smart media (R: Registered trade mark), memory stick (R: Registered trade mark), SD memory card (R: Registered trade mark) and the like are publicly known. “Interface, issued in December 1999, p. 52-p. 55 (CQ Publishing CO., Ltd.)” discloses examples of those cards. A specification of the SD memory card (R: Registered trade mark), such as a shape, a size and the like thereof, is determined by the SD Association.

DISCLOSURE OF INVENTION

When a memory card is used as a recording medium in, for example, a video camera recorder for recording a moving image of a high quality for long hours or the like, a data transfer rate required for recording and reproduction is significantly increased, which leads to a significant increase of a volume of data to be recorded. Therefore, a data transfer rate and a memory capacity of the compact-size memory card such as the SD memory card (R: Registered trade mark) does not always satisfy a required level, which raises an increasing demand for a memory device achieving a higher rate and a larger capacity.

Further, a conventional laptop personal computer may be provided with a slot for the PC card, however, is not generally provided with a slot for the compact-size memory card to be directly inserted into. Accordingly, it becomes necessary to confirm recorded contents of the compact-size memory card in a personal computer in the case of editing the recorded data in the personal computer, and it also becomes necessary to additionally provide an adapter insertable into the PC-card slot or an adapter capable of USB connection, which are quite inconvenient.

Though some memory cards having the PC card size are available, the memory cards of the foregoing type are mainly targeted for some specific industries in recent years. As a current status resulting therefrom, those memory cards have failed to achieve as a fast progress in increasing the rate and the memory capacity as in the compact-size memory card widely available for commercial use and are sold at comparatively higher prices.

The present invention was implemented in order to overcome the foregoing disadvantages, and a main object thereof is to provide a semiconductor memory device suitably used as a recording medium in a host device demanding a higher data transfer rate and a larger memory capacity such as a video camera recorder for recording a moving image of a high quality for long hours, attachable and detachable relative to the host device and thereby portable, and relatively low-budget.

Another object of the present invention is to provide a semiconductor memory device attaining a higher data transfer rate and a larger memory capacity, realizable at a relatively low price, and directly insertable and usable relative to a host device not provided with a slot for a compact-size semiconductor memory card to be directly inserted into such as a conventional laptop personal computer.

Therefore, a semiconductor memory device according to the present invention comprises a housing having a connecting section for connection to a host device, a plurality of compact-size semiconductor memory cards housed in the housing, and a control means for controlling transmission/reception of a signal between the connecting section and the plurality of compact-size semiconductor memory cards.

According to the foregoing constitution, the plurality of compact-size semiconductor memory cards obtainable at a relatively low price is used so that a high data transfer rate and a large memory capacity can be inexpensively realized, and the plurality of compact-size semiconductor memory cards is housed together with the control means in the housing having the connecting section for the connection to the host device to be thereby attachable and detachable relative to the host device and portable.

Further, in the semiconductor memory device according to the present invention, the housing may have a size in compliance with the type II of PC Card Standards and comprise the four compact-size semiconductor memory cards in compliance with the SD Memory Card (R: Registered trade mark) Standards.

According to the foregoing constitution, the compact-size semiconductor memory device, in which the data transfer rate is higher and the memory capacity is increased, can be relatively inexpensively realized, and can be directly insertable and usable relative to the host device not provided with the slot for inserting the compact-size semiconductor memory card such as the conventional laptop personal computer.

The present invention can provide a semiconductor memory device having a thin card shape suitably, used as the recording medium in the host device demanding the higher data transfer rate and larger memory capacity such as the video camera recorder for recording the high-quality moving image for long hours, attachable and detachable relative to the host device and thereby portable, and inexpensively purchasable.

The semiconductor memory device can be directly inserted into the host device, such as the conventional laptop personal computer, not provided with the slot for inserting the compact-size semiconductor memory card such as the SD memory card (R: Registered trade mark) without using an exclusive adapter or the like. Accordingly, data handlings, such as conformation of recorded contents of the compact-size semiconductor memory card and edition of data recorded therein in the host device such as the personal computer, can be effectively facilitated.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1 (a) to (c) are illustrations of an outer shape and a size of a semiconductor memory device according to an embodiment of the present invention, wherein FIG. 1 (a) is a plan view, FIG. 1 (b) is a side view in the direction of Y1 b-Y1 b arrows in FIG. 1 (a), and FIG. 1 (c) is a side view in the direction of Y1 c-Y1 c arrows in FIG. 1 (a).

FIG. 2 is an exploded perspective view of the semiconductor memory device.

FIGS. 3 (a) to (c) are illustrations of an internal structure of the semiconductor memory device, wherein FIG. 3 (a) is a plan view, FIG. 3 (b) is a side view in the direction of Y3 b-Y3 b arrows in FIG. 3 (a), and FIG. 3 (c) is a side view in the direction of Y3 c-Y3 c arrows in FIG. 3 (a).

FIG. 4 is an enlarged illustration of FIG. 3 (c).

FIGS. 5 (a) and (b) are illustrations of the internal structure of the semiconductor memory device, wherein FIG. 5 (a) is a perspective view showing a state in which compact-size semiconductor memory cards 20 are completely set, and FIG. 5 (b) is a perspective view showing a state of a currently ongoing sliding movement of a part of the compact-size semiconductor memory cards 20.

FIG. 6 is a schematic block diagram illustrating a control of the semiconductor memory device.

FIG. 7 (a) to (d) are illustrations of an outer shape and a size of the compact-size semiconductor memory card of the semiconductor memory device, wherein FIG. 7 (a) is a plan view, FIG. 7 (b) is a side view in the direction of Y7 b-Y7 b arrows in FIG. 7 (a), FIG. 7 (c) is a bottom view, and FIG. 7 (d) is a side view in the direction of Y7 d-Y7 d arrows in FIG. 7 (c).

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a preferred embodiment of the present invention is described in detail referring to the drawings.

FIG. 1 are illustrations of an outer shape and a size of a semiconductor memory device having a thin card shape according to the present embodiment, wherein FIG. 1 (a) is a plan view, FIG. 1 (b) is a side view in the direction of Y1 b-Y1 b arrows in FIG. 1 (a), and FIG. 1 (c) is a side view in the direction of Y1 c-Y1 c arrows in FIG. 1 (a). FIG. 2 is an exploded perspective view of a schematic structure of the semiconductor memory device.

As shown in these drawings, a semiconductor memory device 1 according to the present embodiment comprises, as basic components, a housing (case) 10 formed by combining a lower-side member 11 and an upper-side member 12 and a plurality of compact-size semiconductor memory cards 20 housed in the housing 10. The compact-size semiconductor memory card 20 is a resin-packaged semiconductor memory device and formed in a flat card shape having a predetermined shape and size. In the present embodiment, as described later, a memory card conforming to the SD Memory Card (R: Registered trade mark) Standards by the SD Association is used as the compact-size semiconductor memory card 20.

A card bus connector 13 as a connecting section for connection to a host device (not shown) is retained on an end side of the lower-side member 11 in a longitudinal direction thereof. The card bus connector 13 is similar to any conventional and publicly known item and used for the connection to the host device (not shown) such as a video camera recorder and a personal computer using the semiconductor memory device 1. A write prohibition switch 8 is provided on an end surface of the housing 10 opposite to the card bus connector 13.

The housing 10 is formed in a substantially rectangular shape in plan view, and both end sections 10 b of the housing 10 having a predetermined width in a shorter-edge direction thereof are made thinner than an intermediate section 10 a thereof in the same direction. The four compact-size semiconductor memory cards 20 are flatly housed in the housing 10. More specifically, two of the compact-size semiconductor memory cards 20 are adjacently disposed in the shorter-edge direction of the housing 10, and two of the compact-size semiconductor memory cards 20 are also adjacently disposed in the longitudinal direction thereof.

The intermediate section 10 a comprises a first expanding part 10 a 1 and a second expanding part 10 a 2 respectively expanding from the both end sections 10 b in one direction and another direction (upward and downward in FIG. 1 (b)) in a thickness direction of the housing 10. The four compact-size semiconductor memory cards 20 are housed on the first expanding part 10 a 1 side, while a control means of the semiconductor memory device 1 (described later) is disposed on the second expanding part 10 a 2 side.

Next, an internal structure of the semiconductor memory device 1 is described.

FIGS. 3 (a) to (c) are illustrations of an internal structure of the semiconductor memory device 1, wherein FIG. 3 (a) is a plan view, FIG. (b) is a side view in the direction of Y3 b-Y3 b arrows in FIG. 3 (a), and FIG. 3 (c) is a side view in the direction of Y3 c-Y3 c arrows in FIG. 3 (a). FIG. 4 is an enlarged illustration of FIG. 3 (c). FIGS. 5 (a) and (b) are perspective views of the internal structure of the semiconductor memory device 1, wherein FIG. 5 (a) shows a state in which the compact-size semiconductor memory cards 20 are completely set, and FIG. 5 (b) shows a state of a currently ongoing sliding movement of a part of the compact-size semiconductor memory cards 20. In any of FIGS. 3 (a), 3 (b) and 3 (c) and FIG. 4, the housing 10 is shown in a virtual line (chain double-dashed line).

As shown in these drawings, a circuit substrate 30, whose additional role is a retaining plate for retaining the compact-size semiconductor memory cards 20, is provided in the housing 10. More specifically, one surface of the circuit substrate 30 (upper surface in FIG. 3 (b)) constitutes a retaining part for retaining the compact-size semiconductor memory cards 20. The four compact-size semiconductor memory cards 20 are flatly disposed on the one surface of the circuit substrate 30 and thereby retained.

On another surface side of the circuit substrate 30 (lower surface in FIG. 3 (b)) is provided a control circuit 32 serving as a control means for controlling transmission/reception of a signal between the card bus connector 13 and the plurality (four) of compact-size semiconductor memory cards 20.

Further, both edge sections of the circuit substrate 30 in a shorter-edge direction thereof are retained in the both end sections 10 b of the housing 10 in the shorter-edge direction thereof.

Next, a size and the like of the semiconductor memory device 1 is specifically described.

Referring to a size of the housing 10 in the present embodiment, as shown in FIGS. 1 (a), 1 (b) and 1 (c), a width nominal dimension is set to 54.0 mm, a length nominal dimension is set to 85.6 mm, and a thickness nominal dimension of a thickest part is set to 5.0 mm.

As described, the both end sections 10 b having the predetermined width of the housing 10 in the shorter-edge direction thereof are made thinner than the intermediate section 10 a in the same direction. The intermediate section 10 a comprises the first expanding part 10 a 1 and the second expanding part 10 a 2 respectively expanding in the one direction and in the another direction in the thickness direction of the housing 10, and the intermediate section 10 a constitutes the thickest part. More specifically, a thickness nominal dimension of the intermediate section 10 a provided in the length of 48.0 mm in width in a central part in a width direction of the housing 10 is 5.0 mm, and a thickness nominal dimension of the both end sections 10 b having the width of 3.0 mm (=(54.0−48.0)/2) provided on the right and left ends in the width direction is 3.3 mm.

An outer shape and a size of the housing 10 shown in FIG. 1 are in compliance with a size standardized as the Type II of the PC Card Standards by the PCMCIA (Personal Computer Memory Card International Association).

As an example of the card standardized by the PCMCIA, other than the Type II, the Type I of the PC Card Standards, whose nominal dimension of an entire thickness is set to 3.3 mm (constant), and the like, can be mentioned. The thickness of the both end sections 10 b of the housing 10 in the width direction is made thinner than the intermediate section 10 a because a guide rail width of an insertion slot on the host device side can be unified by conforming the thickness of the both end sections 10 b (nominal dimension of 3.3 mm) to the Type I of the PC Card Standards and the like so that the Type I and the Type III can be inserted into the same slot.

The outer shape and size of the Type II of the PC Card Standards is recited in, for example, “PC Card Standard 8.0, Volume 3 Physical Specification, p. 39, issued in 2001 by the PCMCIA”. An external appearance of the card bus connector 13 is also recited in p. 64 of the same literature.

The numeral values of the nominal dimensions denote standard dimensions of the respective sizes, for each of which a small range of tolerance is allowed based on the standards defined by the PCMCIA.

FIG. 6 is a block diagram illustrating a flow of an electric signal of the semiconductor memory device 1 according to the present embodiment. These circuit blocks are housed inside the housing 10.

In FIG. 6, the semiconductor memory device 1 and the host device using the semiconductor memory device 1 (such as the video camera recorder personal computer, which are not shown) are physically connected via the card bus connector 13, and electric-signal-wise connected via a card bus interface 14 in FIG. 6.

The card bus interface 14 is connected to the control circuit 32, and a command such as write/read and data are transmitted between the interface 14 and the host device. The signal transmitted via the card bus interface 14 is subjected to an electrical regulation recited in “PC Card Standard 8.0, Volume 2 Electrical Specification, p. 65-p. 186, issued in 2001 by the PCMCIA”. The card bus interface 14 enables the write/read data transfer at such a high rate as 133 M bytes/sec at maximum (hereinafter, described as MB/sec).

In the present embodiment, a memory card in compliance with the SD Memory Card (R: Registered trade mark) Standards by the SD Association is used as the compact-size semiconductor memory card 20. The four SD memory cards (R: Registered trade mark) 20 and the write prohibition switch 8 are also connected to the control circuit 32. A memory card having the capacity of 512 M bytes and the data transfer rate of 10 MB/sec, for example, is employed as the SD memory card (R: Registered trade mark) 20.

Next, a write operation is described.

In the write operation from host device (not shown) such as the video camera recorder and personal computer to the semiconductor memory device 1, a write command and write data are transferred via the card bus interface 14. The control circuit 32 issues the write command to each of the four SD memory cards (R: Registered trade mark) 20, and divides the write data into four systems and parallelizes them. Then, the control circuit 32 simultaneously transfers the write data thus divided into the four systems and parallelized to the respective SD memory cards (R: Registered trade mark) 20.

As a result of the foregoing operation, the write data transferred via the card bus interface 14 is parallelized in the four systems and written in the four SD memory cards (R: Registered trade mark) 20 respectively having the data transfer rate of 10 MB/sec. Therefore, on the whole, the write data is recorded in the respective SD memory cards (R: Registered trade mark) 20 at the rate of 40 MB/sec in the divided manner. Further, because the write data is recorded in the four SD memory cards (R: Registered trade mark) 20 in the divided manner, a memory capacity of the entire semiconductor memory device 1 corresponds to a total of memory capacities of the four SD memory cards (R: Registered trade mark) 20. In the present example, the total is obtained by multiplying 512 M bytes by four, resulting in 2 G bytes. The card bus interface 14 is capable of exerting the data transfer rate of 133 MB/sec at maximum as described earlier, therefore, does not impose any limit to the transfer rate of 40 MB/sec.

As clearly known from FIG. 1 (c), the write prohibition switch 8 is provided at the end of the semiconductor memory device 1 on opposite side of the card bus connector 13. The switch 8 sets a prohibition of the write with respect to the SD memory cards (R: Registered trade mark) 20 and releases the setting by its opening/closing operation.

The control circuit 32 refers to the write prohibition switch 8 to check if it is opened or closed when receiving the write command from the host device via the card bus interface 14, and does not execute the write operation with respect to the SD memory cards (R: Registered trade mark) 20 when the write is prohibited.

More specifically, the control circuit 32 is provided with a monitor circuit 33 (not shown) for monitoring if the operation state (opened or closed) of the write prohibition switch 8, and controls the write operation with respect to the SD memory cards (R: Registered trade mark) 20 so that it is prohibited when the monitor circuit 33 detects that the write prohibition switch 8 is set on the write prohibition side.

In place of controlling the write prohibition by the control circuit 32 of the semiconductor memory device 1, a detection signal of the monitor circuit 33 may be transmitted to the host device (for example, personal computer) so that the write operation with respect to the SD memory cards (R: Registered trade mark) 20 can be prohibited by a control means of the host device. Further, the monitor circuit 33 may be independently provided outside the control circuit 32.

When the write prohibition switch 8 is operated as described, a possible malfunction, that is to carelessly erase the data already memorized in the semiconductor memory device 1 (in other words, in the respective SD memory cards (R: Registered trade mark) 20), can be effectively prevented.

The write prohibition switch 8 is disposed at the end of the housing 10 on the opposite side of the card bus connector 13 in such manner as operable from outside of the housing 10. Therefore, the confirmation of the opening/closing state and operation of the write prohibition switch 8 can be performed even in the state in which the semiconductor memory device 1 including the housing 10 is inserted into the host device.

Next, a read operation is described.

In the read operation from the semiconductor device 1 to the host device such as the video camera recorder and personal computer, a read command is transferred from the host device side via the card bus interface 14. In the control circuit 32, the data divided and parallelized and then recorded with respect to the four SD memory cards (R: Registered trade mark) 20 in the write operation is read therefrom at the same time. Then, the respective divided data are unified in a procedure reverse to the write operation. The unified data is transferred to the host device via the card bus interface 14.

As a result of the foregoing operation, the data parallelized into the four systems can be read at the same time and unified with respect to the four SD memory cards (R: Registered trade mark) 20 respectively having the data transfer rate of 10 MB/sec. Therefore, on the whole, the data can be read at the rate of 40 MB/sec.

Below is described an assembling step of the semiconductor memory device 1 having the thin card shape according to the present embodiment, that is, how the four SD memory cards (R: Registered trade mark) 20, circuit substrate 30 and control circuit 32 are mounted inside the housing 10 having the limited size.

Prior to the description of the assembling step, an outer shape and a size of the SD memory card (R: Registered trade mark) 20 are described. FIGS. 7 (a) to (c) are illustrations of the outer shape and the size of the SD memory card (R: Registered trade mark) 20 according to the present embodiment, wherein FIG. 7 (a) is a plan view, FIG. 7 (b) is a side view in the direction of Y7 b-Y7 b arrows in FIG. 7 (a), FIG. 7 (c) is a bottom view, and FIG. 7 (d) is a side view in the direction of Y7 d-Y7 d arrows in FIG. 7 (c).

In the description below, a plane surface of the SD memory card (R: Registered trade mark) on which connecting terminals are not provided is referred to as an upper surface, while a plane surface thereof on which nine connecting terminals 21 are provided is referred to a lower surface. Referring to a side surface, one side thereof on which the connecting terminals 21 are provided is referred to as a front surface.

As shown in FIGS. 7 (a) through 7 (d), in each of the SD memory cards (R: Registered trade mark) 20, a width nominal dimension is set to 24.0 mm, a length nominal dimension is set to 32.0 mm, and a nominal dimension of a largest thickness is set to 2.1 mm. More specifically, referring to a thickness direction of the card, a thickness nominal dimension of a central section 20 a in a width direction thereof (part having the width of 22.5 mm) is 2.1 mm, however, a nominal dimension of a thickness of right and left end sections 20 b having the width of 0.75 mm (=(24.0−22.5)/2) is set to 1.4 mm, which is thinner. As clearly learnt from the partially enlarged view of FIG. 7 (d), the end sections 20 b show a stepwise shape in which only the lower surface side provided with the connecting terminals 21 is recessed (gouged).

The foregoing shape of the SD memory card (R: Registered trade mark) 20 is standardized by the SD Association, a simple overview of which is introduced in, for example, “TECHI Intensive Study of PC Card/Memory Card, p. 216-p. 230, issued in October, 2002 by CQ Publishing CO., Ltd.)”.

The numeral values of the respective nominal dimensions each denotes a standard dimension of the size, for which a small range of tolerance is allowed based on the standards defined by the SD Association.

In the semiconductor memory device 1 according to the present embodiment, the respective components constituting the circuit blocks shown in FIG. 6, that are the circuit substrate 30 and the control circuit 32 in addition to the four SD memory cards (R: Registered trade mark) 20 whose outer shape and size are shown in FIGS. 7 (a) through 7 (d), are mounted in the housing 10 whose outer shape and size are shown in FIGS. 1 (a) through 1 (c). How the respective components are mounted is shown in FIGS. 3 (a) through 3 (c) and FIG. 4 described earlier. In any of these drawings, the housing 10 is shown in the virtual line (chain double-dashed line).

As described before referring to the drawings, the circuit substrate 30 retaining the four SD memory cards (R: Registered trade mark) 20 on the one surface thereof (upper surface in FIG. 3 (b)) is provided in the housing 10, and the control circuit 32 is provided on the another surface side of the circuit substrate 30 (lower surface in FIG. 3 (b)). The both edge sections of the circuit substrate 30 in the shorter-edge direction thereof are retained within the both end sections 10 b of the housing 10 in the shorter-edge direction thereof. The control circuit 32 is mounted in the form of, for example, a large scale integrated circuit (LSI).

A signal line from the card bus connector 13 is connected to the circuit substrate 30 (connecting part is not shown). The respective SD memory cards (R: Registered trade mark) 20 flatly disposed on the upper surface of the circuit substrate 30 are mounted on the circuit substrate 30 in such manner that the surfaces thereof respectively provided with the nine connecting terminals 21 (lower surface) are directed upward, and the respective connecting terminals 21 are electrically connected to the circuit substrate 30 via connecting pins 31. The write prohibition switch 8 is also actually connected to the circuit substrate 30, which is, however, not shown in order to simplify the drawing.

As shown in FIGS. 7 (a) through 7 (d), the width nominal dimension of the SD memory card (R: Registered trade mark) 20 is 24.0 mm. Therefore, when the two SD memory cards (R: Registered trade mark) 20 are disposed in the width direction, the width dimensions of the two cards are summed to be 48.0 mm.

However, it is necessary to provide a certain degree of interval (approximately 0.5 mm) between the two SD memory cards (R: Registered trade mark) 20 with regard to a possible expansion, mechanical torsion and the like caused by a temperature rise. As described earlier, the small range of tolerance is allowed for the width dimension of the SD memory card (R: Registered trade mark) 20. Provided that the tolerance is ±0.1 mm, a dimension variability within the scope of the tolerance needs to be considered. More specifically, the total width dimension required for disposing the two SD memory cards (R: Registered trade mark) 20 on the circuit substrate 30 in the width direction is necessarily at least 48.7 mm (24.1 mm+0.5 mm+24.1 mm).

However, as shown in FIGS. 1 (a) through (c), the width dimension of the intermediate section 10 a of the housing 10 (part having the width of 5.0 mm) is 48.0 mm. Therefore, it is not possible to accommodate all of the four SD memory cards (R: Registered trade mark) 20 disposed on the circuit substrate 30 in the intermediate section 10 a of the housing 10 because the actual dimension in the width direction is not long enough to do so. As a result, a part of the SD memory cards (R: Registered trade mark) 20 unavoidably falls on the right and left end sections 10 b (part having the thickness of 3.3 mm).

Referring to the thickness direction, as shown in FIGS. 7 (a) through 7 (d), the thickness nominal direction of the SD memory card (R: Registered trade mark) 20 is 2.1 mm except for a part of the both ends thereof in the width direction. However, provided that a tolerance for the thickness is ±0.15 mm, the thickness is 2.25 mm at maximum after considering a dimension variability within the scope of the tolerance. Because the thickness of the circuit substrate 30 is approximately 0.65 mm, a required thickness resulting from the foregoing numeral values is 2.9 mm.

In contrast to that, the thickness of each of the end sections 10 b of the housing 10 is 3.3 mm, and the thickness of each of the upper and lower members of the housing 10 in the relevant part is approximately 0.25 mm. Therefore, an inner space at the end section 10 b in the thickness direction is allowed to have not more than 2.8 mm (=3.3 mm−(0.25×2) mm), which results in a failure to secure a space thick enough to accommodate the circuit substrate 30 and the SD memory cards (R: Registered trade mark) 20 disposed thereon in the right and left end sections 10 b of the housing 10 (part having the thickness of 3.3 mm).

Hypothetically using a substrate thinner by 0.1 mm (having the thickness of 0.55 mm) as the circuit substrate 30, the thickness of the used circuit substrate and the thickness of the SD memory card (R: Registered trade mark) 20 are summed to be 2.8 mm, which makes it possible for the substrate and the SD memory cards (R: Registered trade mark) 20 to be housed in the end sections 10 b of the housing 10 (part having the thickness of 3.3 mm). However, even in the foregoing case, on the lower side of the circuit substrate 30, a space securable in the intermediate section 10 a of the housing 10 has a dimension of less than 1 mm in the thickness direction, and it is not possible to dispose the control circuit 32 in the foregoing space on the lower side of the circuit substrate 30.

In order to deal with the foregoing circumstances, according to the present embodiment, the SD memory cards (R: Registered trade mark) 20 are mounted on the circuit substrate 30 in such manner that the surfaces thereof provided with the connecting terminals 21 are directed upward. FIG. 4 specifically shows the mounting state.

As shown in FIGS. 7 (a) through 7 (d), in the SD memory card (R: Registered trade mark) 20, the central section 20 a thereof has the thickness of 2.1 mm, while the both end sections 20 b thereof in the width direction respectively have the thickness of 1.4 mm. The both end sections are made thinner than the central section 20 a because the surface side thereof provided with the connecting terminals 21 is gouged (recessed) (see FIG. 7 (d)). The widths of the thinner end sections 20 b are respectively 0.75 mm from the right and left edges.

As specifically shown in FIG. 4, the SD memory card (R: Registered trade mark) 20 is mounted on the circuit substrate 30 in such manner that the surface thereof provided with the connecting terminals 21 is directed upward so that a part of the thinner sections 20 b on the right and left ends of the SD memory card (R: Registered trade mark) 20 stays beyond the intermediate section 10 a of the housing 10 (part having the thickness of 5.0 mm) and fits in the right and left end sections 10 b of the housing 10 (part having the thickness of 3.3 mm).

In the foregoing arrangement, the two SD memory cards (R: Registered trade mark) 20 having the width dimension of 24.0 mm, which are disposed in the width direction with the interval of approximately 0.5 mm secured therebetween, can be safely housed in the housing 10 even after considering the presence of the tolerance (for example, ±0.1 mm) in the width dimension of the SD memory card (R: Registered trade mark) 20.

Further, referring to the thickness direction, the control circuit 32 having the thickness of 1.2 mm can be safely mounted in the presence of a sufficient space on the lower side of the circuit substrate 30. Thereby, all of the circuit blocks shown in FIG. 6 can be housed in the housing 10 whose outer shape and size are set based on the Type II of the PC Card Standards. More specifically, the circuit substrate 30 and the control circuit 32, in addition to the four SD memory cards (R: Registered trade mark) 20, can be housed in the housing 10. The control circuit 32 is formed from an electronic part such as LSI and mounted on the circuit substrate 30 by means of a solder.

Further, in the present embodiment, of the four SD memory cards (R: Registered trade mark) 20 provided in the housing 10, the memory cards adjacently disposed in a length direction of the housing 10 are mounted in a direction where the connecting terminals 21 thereof are in close vicinity, as obviously known from FIGS. 5 (a) and 5 (b).

When the four SD memory cards (R: Registered trade mark) 20 are disposed according to the foregoing constitution, the connecting terminals 21 of the four SD memory cards (R: Registered trade mark) 20 are disposed in close vicinity in around the central section of the housing 10 in the length direction thereof so that the nine connecting pins 31 required for each of the SD memory cards (R: Registered trade mark) 20 can be disposed in around a central section of the circuit substrate 30 in a length direction thereof in a concentrated manner. Thereby, the connecting pins 31 can be efficiently provided.

Further, as clearly learnt from FIGS. 5 (a) and 5 (b), a mounting base 35 for mounting a multiplicity of connecting pins 31 is provided in a substantially central section of the circuit substrate 30 in the length direction thereof so that all of the connecting pins 31 necessary for the four SD memory cards (R: Registered trade mark) 20 can be integrally fit to the mounting base 35. Thereby, the connecting pins 31 can be more efficiently provided, which contributes to a manufacturing cost reduction. Further, the mounting operation of the SD memory cards (R: Registered trade mark) 20 can be facilitated. Further, because there is only a short distance between the mounting base 35 and the control circuit 32 disposed in around the center on the lower surface of the circuit substrate 30, a wiring to be provided can be shortened, and a signal transmitted therebetween can be thereby prevented from deteriorating.

In the case of providing the mounting base 35, as shown in FIG. 5 (b), the respective SD memory cards (R: Registered trade mark) 20 are slid along the upper surface of the circuit substrate 30 until they abut the mounting base 35 so that the connecting terminals 21 are overlapped with the connecting pins 31 so as to assure a contact therebetween. Thereby, an electrical connection can be surely obtained. In this case, the SD memory cards (R: Registered trade mark) 20 are preferably arrested between the connecting pins 31 and the upper surface of the circuit substrate 30 by a vertical energizing force of the connecting pins 31. Alternatively, the respective memory cards (R: Registered trade mark) 20 may be fixedly boded to the upper surface of the circuit substrate 30.

Further, in the present embodiment, referring to the housing 10, the foregoing respective components are housed in the space formed by the lower-side member 11 and the upper-side member 12 as described, and a thermosetting adhesive, for example, is applied to peripheral parts and/or a vicinity thereof of the lower-side member 11 and upper-side member 12 so that the lower-side member 11 and upper-side member 12 are tightly bonded and fixed to each other.

Therefore, when the semiconductor memory device 1 is once assembled, it is not easy to open and dismantle the housing 10, meaning that a user cannot easily remove the internally mounted SD memory cards (R: Registered trade mark) 20 out of the housing 10. In other words, in the foregoing case, the adhesive plays a role as a “restricting mechanism” for restricting the removal of the SD memory cards (R: Registered trade mark) 20 out of the housing 10.

As described, the recorded data from the host device is divided into the four systems and recorded in the four SD memory cards (R: Registered trade mark) 20. Therefore, it is necessary to have all of the four SD memory cards (R: Registered trade mark) 20 and to constantly arrange them in order to reproduce the recorded data. Because it is not easy to remove the SD memory cards (R: Registered trade mark) 20 mounted in the housing 10 therefrom in the present embodiment, the four SD memory cards (R: Registered trade mark) 20 cannot be separately stored and can be always constantly arranged, which assures the reproduction of the recorded data.

The “restricting mechanism” for restricting the removal of the SD memory cards (R: Registered trade mark) 20 out of the housing 10 can employ various types of conventional technologies other than the foregoing adhesive. For example, the lower-side member 11 and the upper-side member 12 of the housing 10 may be fixed to each other by means of thermal adhesion, spot welding or riveting. Further, the SD memory cards (R: Registered trade mark) 20 themselves may be fixedly bonded to the circuit substrate. Moreover, the lower-side member 11 and the upper-side member 12 may be fixed to each other by means of screws having a special shape, which cannot be removed by an ordinary driver.

To describe an alternative method employing a publicly known conventional technology, a protruding piece for engagement is provided in one of the members, while an opening having a slit shape for the protruding piece to be inserted through is provided in the other of the members, and the both members are combined with each other so that the protruding piece is inserted through the slit-shape opening. Thereafter, an edge side of the protruding piece is folded back by means of an exclusive machine tool so that the lower-side member 11 and the upper-side member 12 are mechanically joined together. Also in this case, because an exclusive machine tool is required for disjointing the members to thereby dismantle the housing, the user cannot easily remove the SD memory cards (R: Registered trade mark) out of the housing.

As thus far described, in the semiconductor memory device 1 having the thin card shape according to the present embodiment, the four SD memory cards (R: Registered trade mark) 20 and the control circuit 32 for controlling the SD memory cards (R: Registered trade mark) 20 are incorporated in the housing 10 whose outer shape and size are set based on the PC Card Standards. When a signal from the host device is parallelly memorized in the four SD memory cards (R: Registered trade mark) 20 and read therefrom, the data transfer rate and the memory capacity thereby quadrupled in comparison to the case using one SD memory cards (R: Registered trade mark) 20 can be obtained. Therefore, the thin semiconductor memory device 1 suitable as the recording medium used in the host device for which the higher data transfer rate and the larger memory capacity are demanded such as the video camera recorder for recording the high-quality moving image for long hours can be provided.

Further, the semiconductor memory device 1 conforms to the PC Card Standards, therefore, is attachable and detachable relative to the host device provided with the slot for mounting the PC card described here such as the conventional laptop personal computer and can be handily carried as the recording medium thereof. In particular, the semiconductor memory device 1 can be directly inserted into the host device such as the conventional laptop personal computer without using any exclusive adapter. Therefore, data handlings, such as confirmation of the recorded contents and edition of the recorded data in the host device, can be facilitated. Further, because the card bus interface attaining such a high data transfer rate as 133 MB/sec at maximum is adopted as the interface relative to the host device, the transfer rate cannot be possibly restricted by the interface part.

Further, the semiconductor memory device 1, which employs the SD memory cards (R: Registered trade mark) 20 used for commercial use in great quantities as the incorporated compact-type semiconductor memory, can be relatively inexpensively realized. In addition, the provision of the write prohibition switch 8 can effectively prevent such a malfunction as carelessly erasing the data already memorized in the SD memory cards (R: Registered trade mark) 20.

The present invention is not limited to the described embodiment, and it is needless to say that the present invention can be variously modified and altered within the true spirit and scope thereof.

For example, in the present embodiment, the four SD memory cards (R: Registered trade mark) 20 are flatly disposed on the upper surface of the circuit substrate 30 in such manner that the connecting terminals 21 are directed upward, and the control circuit 32 is disposed on the lower surface of the circuit substrate 30. However, the overall upper and lower relationship in the foregoing arrangement may be reversed. More specifically, the present invention can be realized in such manner that the four SD memory cards (R: Registered trade mark) 20 are flatly disposed on the lower surface of the circuit substrate in such manner that the connecting terminals are directed downward, and the control circuit is disposed on the upper surface of the circuit substrate.

In the present embodiment, the four SD memory cards (R: Registered trade mark) 20 are used as the plurality of compact-size semiconductor memory cards. However, a compact-size semiconductor memory card of some other type, such as a multi-media card, may be used, and the number of the used compact-size semiconductor memory cards is not limited to four.

In the case of the semiconductor memory device 1 according to the present embodiment, the outer shape and the size of the housing 10 conforms to the Type II of the PC Card Standards, however, the present invention is not limited thereto. The portability can be assured in the same manner as far as the housing 10 has the card shape having the thickness of approximately 5.0 mm or below even though the width and the length thereof are different. For example, the housing 10 may have a card shape whose width nominal dimension is 34.0 mm, length nominal dimension is 75.0 mm, and thickness nominal dimension of a thickest part is 5.0 mm, or a card shape whose width nominal dimension is 54.0 mm, length nominal dimension is 75.0 mm, and thickness nominal dimension of a thickest part is 5.0 mm.

In the present embodiment, the card bus interface is employed as the interface relative to the host device. However, the present invention is not limited thereto, and a interface other than the interface may be used. For example, an interface conforming to the PCI Express Standards for transmitting a signal in a serial mode may be adopted so as to further increase the data transfer rate.

As thus far described, according to the present embodiment, the semiconductor memory device having the thin card shape suitably used as the recording medium of the host device for which the higher data transfer rate and the larger memory capacity are demanded such as the video camera recorder for recording the high-quality moving image for long hours, attachable and detachable relative to the host device and thereby portable, and relatively inexpensively obtainable can be provided.

Further, as additional effects of the present invention, the semiconductor memory device can be advantageously directly inserted into the host device such as the conventional laptop personal computer without using any exclusive adapter and used, and the data handlings, such as the confirmation of the recorded contents and the edition of the recorded data in the host device such as the personal computer, can be facilitated.

INDUSTRIAL APPLICABILITY

As described, the semiconductor memory device according to the present embodiment, which can realize a higher data transfer rate and a larger memory capacity, is attachable and detachable relative to the host device and thereby portable, and obtainable at a relatively low price, is suitable as a recording medium of, for example, a video camera recorder for recording a high-quality image for long hours and the like. Further, the semiconductor memory device, which is directly insertable into a PC-card slot without using any exclusive adapter for use, can be also suitably used as a recording medium of a conventional laptop personal computer and the like. 

1-14. (canceled)
 15. A semiconductor memory device comprising: a housing having a connecting section for connection to a host device; a plurality of compact-size semiconductor memory cards housed in the housing; a control means for controlling transmission/reception of a signal between the connecting section and the plurality of compact-size semiconductor memory cards; and the housing is provided with a restricting mechanism for restricting removal of the compact-size semiconductor memory cards out of the housing.
 16. A semiconductor memory device as claimed in claim 15, wherein the housing is formed in a substantially rectangular shape in plan view, and both end sections of the housing having a predetermined width in a shorter-edge direction thereof are made thinner than an intermediate section of the housing in the same direction, the plurality of compact-size semiconductor memory cards is flatly housed in the housing, and at least the two compact-size semiconductor memory cards are adjacently disposed in the shorter-edge direction.
 17. A semiconductor memory device as claimed in claim 16, wherein the four compact-size semiconductor memory cards are housed in the housing, and the two compact-size semiconductor memory cards are also adjacently disposed in a longitudinal direction of the housing.
 18. Semiconductor memory device as claimed in claim 16, wherein the intermediate section comprises a first expanding part and a second expanding part respectively expanding from the both end sections in one direction and another direction in a thickness direction of the housing, the compact-size semiconductor memory cards are housed on the first expanding part side in such manner that a part thereof falls on the both end sections made thinner than the intermediate section, and the control means is disposed on the second expanding part side.
 19. Semiconductor memory device as claimed in claim 17, wherein the intermediate section comprises a first expanding part and a second expanding part respectively expanding from the both end sections in one direction and another direction in a thickness direction of the housing, the compact-size semiconductor memory cards are housed on the first expanding part side in such manner that a part thereof falls on the both end sections made thinner than the intermediate section, and the control means is disposed on the second expanding part side.
 20. A semiconductor memory device as claimed in claim 15, further comprising, a circuit substrate provided with a retaining section for retaining the compact-size semiconductor memory cards on one surface thereof, and the control means is disposed on another surface side of the circuit substrate.
 21. A semiconductor memory device as claimed in claim 20, wherein both edge sections of the circuit substrate in one direction thereof are supported by the both end sections of the housing in the shorter-edge direction.
 22. A semiconductor memory device as claimed in claim 15, wherein the housing has a card shape in which a nominal dimension of a thickest part thereof is at most 5.0 mm.
 23. A semiconductor memory device as claimed in claim 15, wherein the housing has a size in which a width nominal dimension is 54.0 mm and a length nominal dimension is 85.6 mm conforming to PC Card Standards.
 24. A semiconductor memory device as claimed in claim 23, wherein the housing has a size conforming to Type II of PC Card Standards by PCMCIA in which a width nominal dimension is set to 54.0 mm, a length nominal dimension is set to 85.6 mm, and a nominal dimension of a thickest part is set to 5.0 mm.
 25. A semiconductor memory device as claimed in claim 15, wherein the compact-size semiconductor memory cards has a size conforming to SD Memory Card (R: Registered trade mark) Standards by SD Association in which a width nominal dimension is 24.0 mm, a length nominal dimension is 32.0 mm, and a nominal dimension of a thickest part is 2.1 mm.
 26. A semiconductor memory device as claimed in claim 25, wherein the housing comprises: the circuit substrate; the plurality of compact-size semiconductor memory cards flatly disposed on an upper surface of the circuit substrate in such manner that a terminal section is directed upward and conforming to the SD Memory Card (R: Registered trade mark) Standards; and the control means disposed on a lower surface of the circuit substrate.
 27. A semiconductor memory device as claimed in claim 25, wherein the housing comprises: the circuit substrate; the plurality of compact-size semiconductor memory cards flatly disposed on a lower surface of the circuit substrate in such manner that a terminal section is directed downward and conforming to the SD Memory Card (R: Registered trade mark) Standards; and the control means disposed on an upper surface of the circuit substrate.
 28. A semiconductor memory device as claimed in claim 15, wherein the housing comprises a switch means whose operation state is operable from outside of the housing, a monitor means for monitoring the operation state of the switch means is provided, and a write operation with respect to the compact-size semiconductor memory cards is prohibited when the monitor means detects that the switch means is set on a write prohibition side. 